Silicon Die Prep |
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Backside Sample Preparation
Global and localized cutting and polishing
Fully Automated Sample Preparation down to 1um
Global and localized cutting and polishing
Fully Automated Sample Preparation down to 1um
Iterative process designed to keep track of the changing shape of the die Each iteration consists of:
Measuring: Determines the current shape and thickness of the die
Deduction: Determines the optimal path for cutting or polishing based on measurements
Cutting/Polishing: User created recipes and measurements are optimally adapted to cut and/polish samples.
Measuring: Determines the current shape and thickness of the die
Deduction: Determines the optimal path for cutting or polishing based on measurements
Cutting/Polishing: User created recipes and measurements are optimally adapted to cut and/polish samples.
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CNC Interface
Developed to aid in both cutting and polishing Allows user to develop and save recipe for more efficient setup Visual references to aid in accurate setup |
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Performs both global and localized cuts and polishing down to as little as .5 microns thick
Can prepare up to 4 samples in one setup Automatically dispenses slurry during each iteration for true autonomous sample preparation 
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